For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. Reliability can be reduced. Therefore, it is very important to perform a good heat dissipation process on the board.For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. Reliability can be reduced. Therefore, it is very important to perform a good heat dissipation process on the board.

1. For devices employing free convection air cooling, it is preferred to arrange the integrated circuits (or other devices) in a vertically long manner or in a horizontally long manner.

2. Use reasonable routing design to achieve heat dissipation: Because the resin in the board is poor in thermal conductivity, and the copper foil line and hole are good conductors of heat, increasing the copper foil residual ratio and increasing the thermal conduction hole are the main means of heat dissipation.

3. In the horizontal direction, the high-power devices are placed as close as possible to the edge of the printed board to shorten the heat transfer path; in the vertical direction, the high-power devices are placed as close as possible to the top of the printed board to reduce the temperature of other devices while these devices are operating.

4. The devices on the same printed board should be arranged as far as possible according to their heat generation and heat dissipation. Devices with low heat generation or poor heat resistance (such as small signal transistors, small scale integrated circuits, electrolytic capacitors, etc.) should be placed. The uppermost flow (at the inlet) of the cooling airflow, the device that generates a large amount of heat or heat (such as a power transistor, a large-scale integrated circuit, etc.) is placed at the most downstream of the cooling airflow.