Capability - SMT

Lines

9 (5 Yamaha, 4 KME)

Capacity

52 million placements per month

Max Board Size

457 X 356mm. (18” x 14”)

Min Component size

0201 – 54 sq. mm. (0.084 sq. inch), long connector, CSP, BGA, QFP

Speed

0.15 sec/chip, 0.7 sec/QFP

Capability - PTH

Insertion Type

# of Lines

Capacity (points/mth)

Max Board Size

Lead Pitch

Jumper Wire

3

6 million

330X250 mm (13” x 9.8)

5-30 mm

Axial

3

6 million

457x559 mm (18” x 22”)

5-20 mm

Radial

3

9 million

457x559 mm (18” x 22”)

0.36-21.5 mm

Wave Soldering

Wave Soldering

2

Max board width

400 mm

Type

Dual wave

Pbs Status

Lead-free line support

Max temp

399 degree C

Spray flux

add-on

Pre-heat zones

3

Quantity

Prototype&sample PCB Assembly, Small and middle mass prodution is our specialty and we also can handle the orders up to 2000.

Type of  Assembly

THD (Thru-Hole Device), SMT (Surface-Mount Technology), Double-sided SMT & THD mixed

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free.

Components

Passives parts, smallest size 0201;
BGA, uBGA, QFN, POP, and Leadless chips;
Fine Pitch to 0.8Mils;
BGA Repair and Reball; Part Removal and Replacement
Connectors and terminals.

Bare Board Size

Smallest: 0.25x0.25 Inches; Largest: 20x20 Inches.

File Formats

Bill of Materials Gerber Files Pick-N-Place File(XYRS).

Type of Service

Turn-Key, Partial Turn-Key or Consignment.

Component Packaging

Reels,cut tape,Tube and tray,Loose parts and bulk.

Turn Time

3 - 10 days

Testing

X-ray Inspection
AOI (Automated Optical Inspection)
ICT (In-Circuit Test)/Functional Testing