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PCB circuit board via hole plug hole process
Published by: June 18,2019
For surface mount boards, especially for BGA and IC mounting, the via hole must be flat, positive and negative 1 mil, no red tin on the edge of the via hole; tin beads in the via hole, in order to rea...
Method for preventing warpage of PCB printed board
Published by: June 17,2019
1. Why the circuit board requirements are very flat In the automated instrumentation line, if the printed board is not flat, it will cause misalignment, the components can not be inserted into the ...
PCB board OSP technology introduction
Published by: June 11,2019
OSP is the abbreviation of Organic Solderability Preservatives. The Chinese translation is organic solder mask, also known as copper protector. It is also known as Preflux in English. Simply put, OSP ...
Method of deducing schematic diagram in PCB copying process
Published by: June 05,2019
In the research of PCB reverse technology, the reverse push schematic diagram refers to the reverse of the PCB file map or directly draws the PCB circuit diagram according to the physical object of th...
How is the foaming of the PCB surface caused?
Published by: June 04,2019
The blistering of the board surface is actually a problem of poor bonding of the board surface. The extension is also the surface quality problem of the board surface. This includes two aspects: 1. T...
How to copy the PCB?
Published by: June 03,2019
PCB copy board is also called circuit board copy board, circuit board cloning, circuit board copying, PCB cloning, PCB reverse design or PCB reverse research and development. There are many sayings ab...